Micron Laser Technology provides PCB Depanelizer and part excising services for consumer products, original equipment manufacturers, and pcb manufacturers. MLT’s numerous laser machining centers are geared up to handle volumes from prototyping to long production runs. Laser depaneling or part excising can cut through metals, plastics, dielectrics, or a mix of both.
Depending on the material and the part requirements, MLT offers a tool-less part removal process in the form of final depaneling, hold-in tabs, scoring (v-grooves), and perforations. These laser processes have the benefit of speed, positional accuracy, no tooling cost or wear, no part induced stresses, with no cutting oils or some other contaminants.
Hold-in tabs are small uncut sections about the part used to secure the part inside the panel. The hold-in tabs are used for easy of handling small parts or part securement for extra processing. The hold-in tab width is chosen based on the amount of force desired to removed the part from your panel/sheet or known forces to get applied by downstream processes like component loading or electro-polish. MLT can produce tabs in many any material as well as any width and site concerning the part.
Laser scoring generates a limited depth ablation line within the part or material set. The depth is generally 50% of the material thickness but may be controlled to some desired depth. The scoring acts similar to the hold-tab to secure the part inside the panel or sheet, but allows for individual parts to be ‘snapped’ out. Laser scoring lines can also be used being a deliberate path for stress relief or crack propagation. Prototypes utilize scoring lines in metal to accurately bend and form parts into shape without expensive forming dies.
Much like scoring or v-grooves, laser perforations are an alternative choice for tool-less part removal coming from a panel or sheet. Perforations may be laser formed for any size and spacing to fulfill the desired removal and Manual PCB Depanelizer. Depending on the material and the part requirements, BEST laser services provides a tool-less part removal process by means of final perforation, scoring and hold-in tabs. Utilizing a laser to do the depaneling provides the user the benefit of speed and positional accuracy. Unlike mechanical methods there is no part induced stresses, no tooling cost with no cutting oils or other contaminants.
Laser depaneling is great for rigid-flex boards as it provides a precise approach to cut through a variety of materials including however, not restricted to these most frequent materials seen:
Combinations thereof, ideal for thicknesses of rigid flex laser depanelization, rigid flex depanelizedIn addition BEST could be that provider of laser depanelization once you have lots of IoT devices which lmuteg to be precisely machined or reduce to match perfectly into small mechanical enclosures.
Due to the contact-free processing that continues with laser depanelization of printed circuit boards, there is very little distortion even if thin materials are used. When boards are milled or punched out using a mechanical tool there could end up being a loss precision and potentially a distortion within the outside board dimensions. Even worse it could crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and internet based scaling, meaning already existing distortions could be compensated as well as the cut contours positioned precisely in the layout.
The methods for straight line Laser Depaneling, that are set up for rectangular-shaped PCBs, all cut or crush the advantage of the board edge. These techniques include die cutting, punching or V-scoring the assembly or by using a wheel cutter or perhaps a saw. The sawing method typically utilizes a single rotating blade spinning at high RPM to slice the panel in to the shapes required. This process produces heat within the cut out area as
well as creating debris as a byproduct from the cutting operation. In V-scoring the depth of the thickness in the board is 30-40% from the original board thickness because it is cut from either side of the board. After assembly the board is broken at this v-score line. Alternately a “pizza cutter” cuts through the V-score in the panel and cuts the remaining web until the boards will be in their final cutout shape thereby putting strain on the components and solder joints-particularly those close to the board edge. In another method, the singulated board outline can be punched out constitute the panel. This requires that a new punch be utilized for every single type of circuit board which suggests it is far from a flexible type of way of board eliminate. The punch force can also bend or deform the edges from the PCB.